![]() The Participants will work together to bolster the resilience of global supply chains in the semiconductor industry and engage in close discussions on their respective governments’ semiconductor industry programs and potential supply chain risk factors.Potential topics of collaboration may occur in the fields of leading-edge and next-generation semiconductors advanced packaging, including heterogeneous integration and advanced materials, parts, and devices. ![]() The forum may consider mutually beneficial opportunities for technology demonstrations and personnel exchanges to strengthen the innovation performance by businesses, universities, and research centers from both countries. This forum will serve to identify opportunities for collaboration, including potential research and development (R&D) projects, based on each country’s strengths in the semiconductor industry.
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